COB (Chip - On - Board ) Technology

Latest small pitch LED Display technology



What is COB Technology?

COB (Chip-on-board) LED technology is the latest in full colour product advancement using a state of the art, base of chip surface bonding technique combined with high precision dispensing.

How is Chip-on-Board technology formed?

The bare IC is mounted directly on the substrate on the back of the PCB, then using a special method of welding using a pure gold wire, a bond is made between the base and silcon chip, then finally the COB is packaged together to form the full colour module.

What are the advantages of COB Technology?

This new and unique technicalogy has a number of advantages over existing technologies such as SMD and DIP LEDs. Due to the small size of the LED chip, the COB system allows for a much higher packing density than SMD (SMT), the result being a more compact array giving better uniformity and higher intensity even at a close distance and greater heat dissipation for better stability, reliability and lifespan.

The LED Studio employs COB technology in it’s ultra small pitch LED solutions where it becomes the most cost effective and highly impressive solution





led tv pitches



How to define a good LED Screen


  • Stability: Material, Technology process, Heat dissipation
  • Lighting efficiency: Uniformity, Grayscale, Lighting angle, Contrast, Refresh rate, Brightness
  • Durability: Anti-conllision ,Damp and water proof, Dust proof, Anti-oil stain, Anti oxidation, Anti static electricity
  • Power Consumption: Energy saving qualities
High Quality Material
Chip Big chips. Every chip batch wavelength is 1.26nm (+0.625nm) Small chips are used. not enough space for small chip encapsulation on the welding base
Bonding Pure golden wire Generally copper wire is used. Some use alloy wire which is better, some use auminium which is worse
Bracket Immersion gold process Steel bracket. Silver immersion process on welding bracket





Stable technology process


As shown above, SMD's need to use reflow soldering. When the soldering paste reaches a temperature of 240°c the epoxy resin weight loss rate is 80% which easily causes glue to seperate from the LED cup, but in the case of COB technology there is not a reflow soldering process so is more stable. Solder paste does not need to pass through ROHS approval



Advantages of COB LED Display Systems

Light Effection

Good heat dissipation / Low light attenuation

Because the COB chip is directly dispensed onto the PCB, the areaa of heat dissipation is wider than SMD with better attenuation. The heat dissipation of the SMD is emmitted through the bottom of its fixing




Larger viewing angle




Light Effection

Great flux curve distribution

The COB flux curve uniformity is better as it does not seperate like SMD



Better viewing angle

COB small pitch technology has a much wider viewing angle and brightness both indoor and outdoor



High refresh rate

COB uses FPGA scan technology; A P2 refresh rate can exceed 2000Hz and a P2.5 3000Hz



COB is better at with standing collisions and the effects of Oil, Damp, Water, Dust, Oxidisation and dust.


Low Power Consumption




Model Specifications

Spec COB-1.5 COB-1.875 COB-2 COB-2.5S
Pixel pitch (mm) 1.5 1.875 2 2.5
Density (pixels/m2) 444444 284444 250000 160000
Brightness (pixels/m2) 50-1500 50-1500 50-1500 >1200
Module Size (mm) W240 X H180 W240 X H180 W240 X H180 W240 X H180
Module resolution (dots) 160 X 120 128 X 96 120 X 90 96 X 72
Cabinet size (mm) W480 X H540 W480 X H540 W480 X H540 W480 X H540
Cabinet resolution (dots) 320 X 360 256 X 288 240 X 270 192 X 216


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